Mini Breadboard Blue - 170 Points (Ultra-Compact Solderless Prototyping Block)
Streamline your micro-scale electronics layouts and build compact, space-saving prototypes with the premium Mini Breadboard Blue - 170 Points. Engineered explicitly for tight enclosures, small robotic chassis, and shield expansions, this pocket-sized solderless breadboard provides a reliable plug-and-play matrix for testing small components with zero permanent modifications.
When building small smart devices or testing a simple sensor node, standard full-sized breadboards add unnecessary weight, clutter structural footprints, and complicate wire layout tracking. This mini module resolves those spatial overheads by condensing a high-density connection grid into a highly portable, minimalist frame. It serves as the definitive structural foundation for tiny microcontroller breakout boards, standalone sensor modules, localized logic gates, and compact industrial relay triggering paths.
Key Features
Ultra-Compact 170 Tie-Point Grid: Laid out with 170 highly accessible insertion points arranged in a clean, low-clearance column matrix that fits into the tightest spaces easily.
Premium Phosphor Bronze Spring Clips: Upgraded with high-elasticity, heavily plated internal metal contacts that grab component legs and jumper pins tightly, ensuring rock-solid electrical connectivity over time.
Vibrant High-Contrast Blue Finish: Molded in a distinct blue color shell that enables swift visual differentiation when partitioning complex multi-board sub-circuits or designing custom school electronics kits.
High-Contrast Coordinate Silkscreen: Stamped with sharp column numbering and row letters across the grid surface, making it incredibly simple to track wiring paths and prevent insertion errors.
Standardized 2.54 mm Universal Pitch Spacing: Formed around a standard universal grid spacing that accommodates dual-inline-package integrated circuits, transistors, header pins, and standard jumper wires seamlessly.
Interlocking Modular Side Tabs: Designed with pre-molded mating tabs and slots along the outer borders, letting you snap multiple mini blocks together to construct customized, multi-colored prototyping arrays.
Heavy-Duty Self-Adhesive Backing Foam: Pre-fitted with a premium, peel-and-stick adhesive foam pad on the bottom face, allowing you to anchor the board permanently onto heavy workbench plates, robot chassis, or lab desks.
Seamless Customization Support: Built around a highly adaptive modular manufacturing layout. If your specialized educational package or commercial product kit requires custom baseplate boundaries, bundled wire assortments, or unique branding layouts, we can easily configure the packaging and structural design to fit your exact blueprint specifications.
Technical Specifications
Feature | Specification |
Product Model Classification | Mini-Size High-Density Solderless Prototyping Breadboard |
Total Available Contact Points | 170 Insertion Tie-Points Total Grid Index |
Component Matrix Configuration | Split into dual 5-pin column arrays (17 rows total per side) |
Internal Metal Grip Material | High-Elasticity Phosphor Bronze Structural Clips |
Outer Enclosure Body Compound | Flame-Retardant ABS Impact-Resistant Engineering Polymer |
Clean Output Lens Color | Vibrant High-Visibility Blue |
Supported Wire Insertion Range | Fits standard solid jumper wire sizes comfortably |
Design Flexibility Feature | Bespoke packaging, tailored baseplate integrations, and kit bundles accepted on demand |
Internal Structure & Distribution Layout
The contact points inside this 170-point mini board are pre-routed in a highly logical grid pattern to maximize wiring efficiency while keeping the footprint exceptionally neat:
Vertical Component Columns (Center): The main body is divided by a central valley channel into two matching halves. The 5 pins in each vertical row are electrically bonded together behind the plastic, forming an instant common connection node for your components.
Central Integrated Circuit Valley: The middle spacing channel matches the exact physical footprint of standard dual-inline package chips, letting you straddle processors or logic gates across the divide so their pins remain completely isolated from one another.
Localized Power Flexibility: Because this mini format lacks dedicated full-length horizontal power rails, any vertical 5-pin row can be easily designated as a dedicated local positive power or ground distribution track for your sub-circuit.
Common Applications
Wearable Prototyping & Micro-Robotics: Integrate into small wearable electronics housings or tiny insect-bot chassis frames where fractions of a gram matter.
Isolated Sensor Block Diagnostics: Set up quick standalone test benches to calibrate analog temperature elements, light-dependent resistors, or ultrasonic modules away from noisy power grids.
Industrial Relay Performance Benchmarks: Assemble and test automated triggering paths to control multi-channel 1-channel, 2-channel, and 4-channel industrial relay modules safely without hot soldering irons.
Educational Academic Innovation Laboratories: An essential, highly durable structural teaching asset for student engineering classrooms, introductory coding labs, and vocational electronics training courses.
Package Includes:
1 x Mini Breadboard Blue - 170 Points (Premium Solderless Profile)